Graham Reed receives industry PIC Award
Professor Graham Reed recognised for his contribution to the photonics industry.
A spiral waveguide
A photonic chip integrated to a PCB
Coupling light into a spiral waveguide
A wide-band MMI

The CORNERSTONE team are in the process of applying for additional funding from EPSRC (UK Engineering and Physical Sciences Research Council) to introduce new platforms to the current CORNERSTONE capabilities.

The proposed new platforms are as follows:

  1. Flip-chip bonding of electronic circuits to photonics
  2. Pick and place of laser dies to facilitate on-chip light sources for multiple applications
  3. A high confinement Silicon Nitride photonics platform with thickness up to 1µm
  4. An undercut Silicon Photonics platform to facilitate photonics circuits that operate at wavelengths up to 4µm
  5. A Germanium on Silicon platform for photonics circuits that operate at wavelengths up to 12µm

More information can be found in the document below.

The current SOI capability will continue to operate as it has done for the previous 2 years. All users will be charged at the rates advertised on the Schedule & Cost page.

If you are interested in any of the above platforms, we would greatly appreciate a letter of support to enhance our proposal. Please email This email address is being protected from spambots. You need JavaScript enabled to view it. if you would like to support us.

Call Announcement

LIVE: MPW 14th Call

CORNERSTONE users are invited to submit designs to the final free to access (UK academia only) fourteenth call ...

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Future Calls

Schedule & Cost

Below is the tentative schedule for future MPW calls (updated January 2019)*: *MPW schedule subject to change.

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CORNERSTONE 2

CORNERSTONE 2 Proposal

The CORNERSTONE team are in the process of applying for additional funding.

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