MPW 13th Call for Passive Devices with Heaters - SIGN UP DEADLINE NOW PASSED

CORNERSTONE users are invited to submit designs to the thirteenth call. The platform is 220 nm Si / 2 µm buried oxide (BOX) silicon-on-insulator (SOI).


A process design kit (PDK) is available using Luceda’s IPKISS software, subject to purchasing the appropriate license. To obtain a copy of the software and a license key, please contact Luceda by sending an email to This email address is being protected from spambots. You need JavaScript enabled to view it., specifying that you require a license for CORNERSTONE PDK usage. Of course, the CORNERSTONE PDK is free of charge if you already have a valid IPKISS license.  


Access to this run is free of charge for UK research institutes (funded by EPSRC). Overseas universities and industrial companies can access this run with the following cost options:


Design area: 11.47 mm x 4.9 mm = £10,000.

Design area: 5.5 mm x 4.9 mm = £7,000.


The sign-up deadline is Friday 17th May 2019. The mask submission deadline is Friday 28th June 2019.


For more information, full design rules and quick reference design rules, please download the CORNERSTONE 13th Call Design Rules documents and the .GDSII template files.




In order to help you ensure that you comply with the design rules, you can also download a design rule check (DRC) checklist and if you have access to Tanner L-Edit software, a .tdb version of the template containing a DRC file that you can run to automatically find any design rule violations (note that the automatic DRC will not check all of the design rules, so it remains very important to read the design rules in detail).



For any queries, including questions on bespoke processing i.e. custom etch depths etc., please contact This email address is being protected from spambots. You need JavaScript enabled to view it.