Tyndall National Institute
Tyndall National Institute have developed a standardised, cost-effective, “off-the-shelf” photonic packaging solution that fully supports CORNERSTONEs silicon photonic PIC platforms.
Key specifications are listed below:
Grating Coupling Generic Package | Specification |
Mechanical base dimensions (ext. dimensions (w/ pins and ports)) | 104mm × 90mm × 9mm |
Compatible PIC dimensions | From 3 × 3 mm to 10 × 10 mm |
PCB dimensions | 60mm × 48mm on each side |
Electrical Packaging | Wire bonding (from either north/south side of PIC) |
DC connections | Up to 120 DC connections 2 × 60 DC connections in each PCB split |
Bond pad dimensions and pitch | 125µm × 1000µm, and a 250µm pitch |
Thermal solutions | Yes – Thermistors (10kOhm) and TEC (8W) |
Waveguide Pitch | 127µm or 250µm |
Optical Channel Count | 12, 24 |
Optical shunts – no. of channels | 4 for edge coupling and 2 for grating coupling |
Fiber Type | SMF & PMF |
Optical Interface | 2 × Fiber Arrays (from either west/east side of PIC) |
The service is accessible through Europractice, where further information regarding design rules and pricing can be found here https://europractice-ic.com/services/packaging/photonics-packaging/
For more information, please contact simon.sorensen@tyndall.ie