Bay Photonics

Bay Photonics – Specialists in Advanced Photonic Assembly and Packaging, Engineered for Precision.

Bringing a photonic device to market is a complex journey, design precision, thermal stability, optical alignment, and reliability all engineered and realised into a high performance packaged assembly.

At Bay Photonics, we cover the full lifecycle of photonic packaging, from concept and first prototypes to full-scale production. We specialise in every stage of assembly and packaging with the flexibility, speed, and reliability your product demands.

From quantum and sensing, to medical, space, defence and telecom, our expert team brings decades of experience in Photonic Assembly and Packaging, alignment, sealing and testing. Bay Photonics has established expertise is fibre technology interfacing techniques to suite the PIC design including material properties, waveguide geometry, high optical port counts, whether single mode and/or polarisation managed including Butt Coupling, Lens Coupling, & Quasi Planar Coupling to PIC gratings.

Bay Photonics can package your PIC in a prototype Bay photonic Evaluation Vehicle (BEVi). Two vehicle footprints exist BEVi & Mini-BEVi, which provide the optical and electrical including DC & high speed RF interfacing required to enable a successful evaluation of your PIC design prior to committing to expensive custom packaging. Please contact Bay Photonics for further information and to discuss your requirements.

Bay Photonics is your packaging partner taking your innovation through prototype to production.

Bay Photonics Evaluation Vehicle – BEVi:

Bay Photonics Mini-BEVi:

Key specifications are listed below:

Grating Coupling Generic Package
Specification
Mechanical base dimensions (ext. dimensions (w/ pins and ports)) 
BEVi:  WHL 135x75x18 mm                                                                      Mini-BEVi:  WHL 64x38x13 mm
Compatible PIC dimensions
BEVi & Mini-BEVi:  SoI, GaAs, SiN, SiPh, LiNbO3 & InP compatible
DC connections
BEVi:  40 way North & South                                                                    Mini-BEVi:  50 way North & South
High Speed RF Interface
BEVi:  Low frequency (kHz) only.                                                              Mini-BEVi: Microwave connectivity, GPO & GPPO, GHz capable
Bond pad dimensions and pitch
Compatible with commercial industrial precision bonding equipment accuracy +/-2.5 µm 3 sigma. Au & Al wire, Ball & Wedge bonding.
Thermal solutions
Closed-loop TEC cooled & non-cooled solutions availableNTC thermistor for closed-loop control
Waveguide Pitch
127 & 250 µm
Optical coupling technology
Butt Coupling, Lens Coupling, & Quasi Planar Coupling to gratings possible
Optical Channel Count
1 – 64 East & West, 1D & 2D arrays possible
Optical shunts – no. of channels
First & Last
Fiber Type
SMF, PMF, MMF compatible
Optical Interface
FC/APC, FC/UPC, MPO, subject to discussion

 

Contact information

Address​:

Bay Photonics Ltd,

Electronics & Photonics Innovation Centre (EPIC),

White Rock Business Park,

Waddeton Close,

Paignton TQ4 7RZ

Email:  info@bayphotonics.com

Phone:  01803 714744

Website:  Bay Photonics