Deep-UV Lithography

We offer a deep-UV projection lithography service for 8” (200 mm) silicon-based substrates. Our service is capable of patterning 200 nm features, with a maximum design area of 24 mm x 32 mm.

We cater to a wide range of project requirements by offering three distinct resist thicknesses, all utilising a positive tone resist where the exposed areas are developed: 680 nm, 1 µm, and 1.3 µm.

Watch our lithography process in action:

Accessing our Lithography Service

To utilise our lithography service, please follow the steps below. For further guidance or to discuss your specific lithography needs, please do not hesitate to contact our team. We are here to support you through every step of the process, ensuring a seamless experience from design to execution.

Review Design Rules and Costs

Begin by downloading and reviewing the Design Rules to ensure your project aligns with our service capabilities. For detailed pricing information, please refer to the cost tables at the end of this page.

Complete the Reticle Order Form

When your design is ready, fill in our reticle order form to order a reticle tailored to your specifications. You will be required to upload a purchase order to this form.

Submit Your Job

When you’re ready to move forward, submit your job using the deep-UV job submission form. You will be required to upload a purchase order to this form.

Deep-UV Lithography Costs

Item Cost  (£)
Setup & 1st wafer (lithography only) £4,770
Each additional wafer (lithography only) £500
Setup & 1st wafer (lithography & CD-SEM analysis) £5,125
Each additional wafer (lithography & CD-SEM analysis) £735

Reticle Costs

Reticle Grade
Pellicle
Min. Design Feature Size (μm)
Cost (£)
Standard
No
0.5
£800
High
No
0.2
£1,350
Ultra-High
No
0.125
£2,600
Standard
Yes
0.5
£975
High
Yes
0.2
£1,575
Ultra-High
Yes
0.125
£2,900