CORNERSTONE Packaging Partners

PHiX Grating Coupler-Based Optical Packaging Template 

We are pleased to announce that the PHiX grating coupler-based optical packaging template is now available for use with all CORNERSTONE technology platforms.

This generic packaging template supports optical and electrical interfacing for CORNERSTONE multi-project wafer (MPW) chips, enabling seamless integration with PHiX Photonics Assembly packaging solutions.

The CORNERSTONE MPW-compatible packaging template can be downloaded here.

 

Key specifications are listed below:

Grating Coupling Generic Package
Specification
Mechanical base dimensions (ext. dimensions (w/ pins and ports)) 
143.7 x 78 x 15.2 mm 
Compatible PIC dimensions
From 4 × 4 mm to 20 × 20 mm
PCB dimensions
38.4 x 28.2 x 1.5 mm
Electrical Packaging
Wire bonding (from either north/south side of PIC)
DC connections
Up to 60 DC connections in each PCB split
Bond pad dimensions and pitch
150 µm x 150 µm and a 200 µm pitch
Thermal solutions
Yes – Thermistors (10kOhm), TEC (20W) and cooling carrier 
Waveguide Pitch
127µm or 250µm
Optical Channel Count
Up to 32
Optical shunts – no. of channels
1x loop around for GC (2x loops for EC)
Fiber Type
SMF & PMF (1550nm)
Optical Interface
2 × Fiber Arrays (from either west/east side of PIC)

 

For technical enquiries, please contact: pdkteam.cornerstone@soton.ac.uk

Our Partners

For pricing and additional information, please visit PHiX Photonics Assembly.