Bay Photonics – Specialists in Advanced Photonic Assembly and Packaging, Engineered for Precision. Bringing a photonic device to market is a complex journey, design precision, thermal stability, optical alignment, and reliability all engineered and realised into a high performance packaged assembly. At Bay Photonics, we cover the full lifecycle of photonic packaging, from concept and…
Uncategorized
Alter UK
Alter’s Somerville package offers an affordable standardised evaluation platform with hermetic capability for fast prototyping. The Somerville 2 package platform has 40 DC IOs, 8x ground-signal-ground connections, and a single fibre array, and Somerville 3 has dual fibre array and 80x DC IOs. The fibre and connector type is completely customisable. Standard interposers are designed…
Tyndall National Institute
Tyndall National Institute have developed a standardised, cost-effective, “off-the-shelf” photonic packaging solution that fully supports CORNERSTONEs silicon photonic PIC platforms.
PHIX Photonics Assembly
PHIX Grating Coupler-Based Optical Packaging Template Now Available for CORNERSTONE Platforms We are pleased to announce that the PHIX grating coupler-based optical packaging template is now available for use with all CORNERSTONE technology platforms. This generic packaging template supports optical and electrical interfacing for CORNERSTONE multi-project wafer (MPW) chips, enabling seamless integration with PHIX Photonics…